What is a BGA used for?

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.

What is BGA in laptop?

(Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used.

What is inside a BGA?

What is a BGA? A Ball Grid Array Integrated Circuit is a surface mount device (SMD) component that possesses no leads. This SMD package employs an array of metal spheres that are made of solder called the solder balls for connections to the PCB (Printed Circuit Board).

How is BGA made?

A Ball Grid Array or BGA Assembly is a form of surface mount technology (SMT) that uses tiny solder balls underneath the IC package to connect to the substrate or PCB. These gold balls convey electrical signals to the traces for the BGA. BGA assemblies are being used increasingly for integrated circuits.

What is the difference between BGA and LGA?

Essentially, the most basic difference between the two is that an LGA based CPU can plugged in and out of the motherboard and can also be replaced. A BGA based CPU, however, is SOLDERED on the motherboard and thus cannot be plugged out or replaced. The BGA based CPUs are generally found in mobile devices like laptops.

How do I check my BGA?

X-Ray Inspection The most advanced inspection method for BGAs is X-ray inspection. X-rays work by emitting X-ray energy from an X-ray tube onto the board. X-rays pass through the board at differing amounts, with more X-rays trapped in dense areas such as solder joints.

What is BGA connector?

BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.

What is the difference between BGA and FPGA?

FPGA is most likely to be packaged in a BGA (Ball Grid Array) package type as showed in the below figure. BGA is a very common package type that used widely in various applications. The package balls are clearly on the bottom size of the FPGA and they are connected internally to the FPGA silicon die.

What is BGA substrate?

A BGA substrate is essentially a carrier that’s use with many types of BGA package. For complex devices like microprocessors a BGA substrate needs to provide many different interconnection pins and a process for designing all of these pins and integrating them into the package can actually be extremely complicated.

Which is better in BGA and LGA?