What is plasma sputtering?

Sputtering is a plasma based deposition process in which energetic ions are accelerated towards a target. The ions strike the target and atoms are ejected (or sputtered) from the surface. These atoms travel towards the substrate and incorporate into the growing film.

What is sputtering coating?

Sputter coating is a physical vapor deposition process used to apply a very thin, functional coating on a substrate. The process starts by electrically charging a sputtering cathode which in turn forms a plasma causing material to be ejected from the target surface.

What is sputtering used for?

Sputtering targets are used to produce low-radiation coated glass – also known as Low-E glass – which is commonly used in building construction because of its ability to save energy, control light, and for aesthetics. Demands for renewable energy are on the rise.

How do you generate plasma from sputtering?

A plasma is created by ionizing a sputtering gas (generally a chemically inert, heavy gas like Argon). The sputtering gas bombards the target and sputters off the material we’d like to deposit. Ions can be generated by the collision of neutral atoms with high energy electrons.

Why is argon used for sputtering?

The reason for using argon is that it is necessary to replace oxygen and water vapor in highly reactive air with less reactive gases. Nitrogen and argon are often used as lowly reactive gases. Since nitrogen is reactive at high temperatures, argon gas is often used.

Is sputtering line of sight?

Sputter deposition is also a line of sight technique similar to plasma spraying. By applying bias voltage on the substrate holders, the positive ions of the plasma gas start hitting the target and erupts the CaP that eventually are deposited on the substrates (Fig.

Why is argon used in plasma?

Argon prevents the oxidation of the surface as the plasma breaks the oxygen bond with the metal surface and carries it out of the chamber.

What is the typical pressure for sputtering?

The sputtering atmosphere is a mixed gas atmosphere of argon and oxygen (Ar : O2 = 50 sccm : 50 sccm). The substrate temperature during the sputtering process was room temperature. The sputtering process pressures are 0.5, 1.0, 1.5, and 2.0 Pa, respectively, and the sputtering time is 120 min.